Standing director of the branch and above enterprises, expert committee members, member enterprises and industry organizations:

In order to further promote the extension of the industry to major national areas, build an exchange platform between upstream and downstream of the industry, guide the transformation and upgrading of the industry, and promote the high-quality development of the industry, after discussion, the branch will jointly organize and hold the "Summit Forum on Advanced Technology Innovation and Application Development of Wide Band Semiconductor" in conjunction with Zhongguancun Tianhe Wide Band Semiconductor Technology Innovation Alliance ". At the same time, the branch will hold the "sixth and fifth executive director (enlarged) meeting" to summarize and analyze the industry situation in 2022 and the first half of 2023, and announce the "celebration of Chinese artificialDiamondProgress in the preparations for the 60th anniversary of the birth of the General Assembly. The specific arrangements are hereby notified as follows:

1. meeting time

9-11 August 2023

2. Meeting Venue

Hotel: Beijing Railway Building

Address: No. 102, North Honeycomb, Haidian District, Beijing

3. schedule

August 9: All day.

August 9: 19:30-21:00 The Fifth Standing Council Meeting of the Sixth Session of the Branch

August 10-11: Summit Forum and Exhibition on Advanced Technology Innovation and Application Development of Wide Gap Semiconductor

August 12: Return

Main Agenda of the Standing Council of the 4.

1. Review the work summary of the branch in 2022 and the first half of 2023 and the work plan for the second half of 2023;

2. Review the relevant bills of the branch and inform the progress of the celebration of the 60th anniversary of the birth of synthetic diamonds in China;

3.superhard materialA brief analysis of the development of the industry in 2022 and the first half of 2023.

Main Agenda of 5. Wide Band-Gap Semiconductor Advanced Technology Innovation and Application Development Summit Forum

(I) Conference Highlights

Highlight 1-authority: it is planned to invite leaders of ministries and commissions, academicians and experts, leading enterprises, well-known institutions, etc. to solve doubts and predict the future;

Highlight 2-Comprehensive: The forum focuses on unlocking bottlenecks and technological innovations brought about by the whole industry chain, such as equipment (consumables)-substrate-extension-device-module-application (terminal application);

Highlight 3-Innovation: Discuss the application of advanced technologies such as growth, processing and epitaxy of wide band gap semiconductor materials represented by 8-inch silicon carbide, as well as effective measures to improve product quality and reduce costs;

Highlight 4-Development: Decrypt the layout, capacity planning and development trends of wide-band semiconductors, and predict potential opportunities in the medium and long term.

(II) Conference Topics

1. Wide band gap semiconductor material growth:

3C Silicon Carbide Growth Technology

Development Progress of 8-inch Silicon Carbide Industry

Progress in liquid phase growth of silicon carbide

Preparation route of high quality silicon carbide single crystal composite substrate

Gallium Nitride Crystal Growth and Analysis of Its Physical Properties

Preparation Technology of Inch Grade Single Crystal Diamond Substrate

Development and industrialization of large diameter silicon carbide epitaxial wafer

Progress of Large Size Gallium Nitride Materials

2. Wide band gap semiconductor device technology and application:

Trends and Challenges in Silicon Carbide Devices

Key Technology of Silicon Carbide MOSFET

Key Technology of Silicon Carbide Power Devices in New Energy Vehicles

Key Technology of High Voltage Silicon Carbide Devices in Power System

Gallium Nitride Process RF Performance and Model Evaluation

Fabrication and sealing process of gallium nitride laser

3. Wide band gap semiconductor key equipment technology:

Study on Preparation and Key Technology of Silicon Carbide Crystal by Resistance Method

For silicon carbide cuttingdiamond wire sawThe development process

Silicon Carbide Laser Lift-off Technology

Silicon carbide grinding and polishing process route

Application of diamond products in wide band gap semiconductor manufacturing process

Key Technology of Silicon Carbide High Performance Epitaxial Growth

6. Registration

1. Participants should fill in the receipt (attachment) and send an email to the branch secretariat for registration from July 1 to August 1, or fill in personal information for registration by scanning the QR code.

2. The conference fee is 2000 yuan/person, and the branch member unit is 1600 yuan/person, including conference materials and meals. Delegates are requested to book hotels in advance at their own expense.

Details of the conference hotel: Beijing Railway Building Double Bed/Big Bed 535 Yuan/Night/Room (Single Morning) Beijing Railway Building (Ordinary Express) 398 Yuan/Night/Room (Single Morning) Hotel Tel: 010-51879108/010-51879171 Note: The conference hotel is an agreed price, limited in quantity, please book in advance.

3. During the meeting, there will be a desktop booth with a price of 15000 yuan/unit and a branch member unit of 12000 yuan/unit (including booth production), which is mainly aimed at users of wide band gap semiconductor materials and devices. Superhard materials and related enterprises are located in the southern district. the number of booths is limited. please contact the branch secretariat for enterprises that need publicity and display.

7. Remittance Routes

Account name: China Machine Tool Industry Association

Opening Bank: Industrial and Commercial Bank of China, Beijing Lishi Road Sub-branch

Account number: 0200003609014472742

Remittance please indicate: super hard meeting

8. contact information

Zhang Beibei:

18538105013  zbb@cmtba-ida.org.cn
Li Lijuan:
15670608488  llj@cmtba-ida.org.cn

Address: 450001, 121 Wutong Street, High-tech Zone, Zhengzhou City

28 June 2023
Superhard Materials Branch of China Machine Tool Industry Association

Super Association Meeting Receipt. xlsx